Authors:

Rongkai Yu

Date Created:

Not specified

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About Paper:

The strength of solder materials can vary widely depending on the material composition of the alloys. Knowing how different solder alloys behave at different temperatures and aging conditions is critical to understanding the long-term reliability of electronic products assembled with these solder alloys. However, understanding the machines and programs involved in conducting experiments is also essential to improving the efficiency and quality of data collection. This study serves to develop an understanding of the mechanical characteristics and software programs related to the experimentation of three SnBi (tin- bismuth) solder alloys with microalloying elements. Additionally, relevant functions and legacy MATLAB scripts are analyzed to prepare for the decommission of the current tester and the commission of a revamped tester. Flowcharts are created for the core scripts to illustrate their logic and all related code are thoroughly reviewed for obsolete code. During the experiments, solder material specimens are mounted on specialized precision testers with closed loop control and undergo experiments to determine their mechanical behavior under creep, fatigue, and monotonic loading. Test data regarding mechanical strength was collected on-site and analyzed, and the samples were then sent to for microstructural analysis. It was observed that the solder materials often have higher saturation stress at lower temperatures and at unaged conditions. Both data about saturation stress acquired from monotonic tests and data about creep resistance from creep tests suggest that all three materials are more resistant to stress and strain deformation when aged.

Source:

Purdue University / 2023

Topics:

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Co-authors:

Rongkai Yu