Authors:

Daksh Kumar Singh

Date Created:

Not specified

Course Title:

Professor:

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About Paper:

Over the past half-century, the semiconductor industry has seen extraordinary growth. This expansion necessitated the division of the fabrication pipeline into multiple steps, each of which has the potential to introduce security vulnerabilities. In order to enhance security within these weak links, we have incorporated gold nanoparticles into the packaging material as stealthy tags. These nanoparticles contribute to fortifying the overall process, minimizing the likelihood of disruptions or tampering. In this study, we examine the efficacy of plasmonic verification methods using gold nanoparticles, randomly dispersed on the surface of microelectronic device packaging. These nanoparticles serve as stealth tags; their spectra produces a unique physically unclonable function that cannot be duplicated. We utilize the Drop Casting method to implant these particles and analyze the samples using Dark Field Microscopy and Variable Angle Spectroscopic Ellipsometry. Furthermore, we compare the spectral variance in relation to the differing concentrations of nanoparticles. This comparison enables us to determine the optimal density and particle placement ratios for secure verification. Our results indicate that the second peak intensity of the spectra has a correlation with the particle density in both coating methods. The spectra are blue-shifted when the concentration is constant and the reflection angle increases, and red-shifted when the reflection angle is kept constant, while the concentration is increased. These findings suggest that gold nanoparticles provide random and unique spectral tags for the verification of microelectronics. Future research will involve the application of machine learning to develop robust verification frameworks based on these plasmonic spectral tags.

Source:

Purdue University / 2023

Topics:

No topics listed

Co-authors:

Daksh Kumar Singh