Authors:

Andrew Modin

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About Paper:

Electroplating plays a critical role in the fabrication of high aspect ratio through-silicon vias (TSVs) in microelectronics. However, achieving optimal electroplating parameters for desired quality and processing time remains a challenge. This comprehensive study employs the COMSOL electrodeposition module to simulate the electroplating of high aspect ratio TSVs, with a focus on tracking trends associated with additives, specifically the chloride-polyethylene glycol suppressor and the 3-mercapto-1-propanesulfonate (MPS) accelerator. This will help enhance understanding of the relationship between these additives and electroplating quality, aiming to improve electroplating time, uniformity, and cost-effectiveness. Currently, conventional electroplating techniques often encounter issues such as uneven deposition, voids, and poor adhesion. To overcome these challenges, a modeling approach is adopted using COMSOL's electrodeposition module to reduce research costs and drastically decrease research times. Various combinations of additives are investigated to evaluate their impact on improving electroplating quality. The analysis reveals trends related to additive concentration and distribution, providing insights into factors like deposition uniformity and surface roughness. These findings contribute to a better understanding of the underlying mechanisms in electroplating and inform the development of strategies to optimize electroplating parameters. In conclusion, this research utilizes COMSOL simulations to investigate the correlation between additives and electroplating quality in high aspect ratio TSVs, shedding light on the relationships at play.

Source:

Purdue University / 2023

Topics:

No topics listed

Co-authors:

Andrew Modin