Authors:

Rishipreet Singh Dhir

Date Created:

Not specified

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About Paper:

One of the leading problems in microelectronics is the assembly of components and their reliability with solder joints. Solder is frequently used to join components electrically and mechanically in electronic packaging. However, frequent mechanical cracking at the solder joints occurs, leading to mechanical failure. This research is crucial as it improves microelectronics, enabling smaller, lighter components for efficient products like cell phones and medical devices through modern material manufacturing. This research aims to understand the use of viscoplastic materials for better failure mode and its reliability in electronic packaging. Viscoplastic materials exhibit time-dependent strain which help in examining the shear stresses during various fatigue, creep and monotonic testing conditions. The research involves characterizing solders through fatigue testing and constitutive modeling. Fatigue testing involves applying a load profile resembling real-world conditions to assess durability, number of cycles to reach failure, low-melting point eutectic solder alloys in various testing conditions. Alternatively, constitutive modeling predicts stress-strain responses under various load conditions, typically through monotonic and creep tests. The research analyzes the shear strain over time and creates a damage accumulation model that considers material responses based on current and prior loading. Analysis of these results helps us understand what composition of materials work best for microelectronics, microstructural complexity, and complex rate-dependent mechanical behavior. Further research is required in creating a better temperature-controlled environment, tooling fixtures for less error propagation and simultaneous testing conditions for micro and nano precision testers to allow ease of repeatability and larger dataset for analysis of solder sample. Keywords: Viscoplastic; Fatigue Testing; Microelectronics; Electronic Packaging; Solder Joints

Source:

Purdue University / 2024

Topics:

No topics listed

Co-authors:

Rishipreet Singh Dhir