Authors:

Johan Martinez

Date Created:

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About Paper:

Electronic packages are present in our everyday devices and there is a constant need to make the devices smaller every year. These devices dissipate heat over time and the demand for miniaturization needs robust and effective thermal management. A typical electronic package consists of different materials and interfaces that act as bottlenecks for heat dissipation. Thermal interface materials (TIMs) are highly thermally conductive substances used across the interfaces to decrease thermal resistance by replacing the small air pockets. One commonly used form of these materials is thermal grease, which is easy to handle, cheaper than other forms of TIMs, and has good thermal conductivity. However, thermal grease suffers from pump-out degradation, which occurs when two materials with different coefficients of expansion push and pull the thermal grease outwards and outside of the interface. This can be seen by the presence of voids and overall deterioration of the material's performance, thereby reducing the reliability. Hence, it is increasingly important to understand how this happens and how to prevent it. Our research aims to analyze how the non-flatness of mating surfaces sharing interface plays a role. We will perform temperature cycling experiments on grease TIMs and use different forms of curved lenses and aluminum heaters to mimic the temperature fluctuations of electronic devices. The investigations aim to provide a better understanding of how surface shape affect the degradation of TIMs and share insights about their reliability. Keywords: Grease; Thermal Interface Material; Pump-Out; Voids

Source:

Purdue University / 2024

Topics:

No topics listed

Co-authors:

Johan Martinez