Authors:

Ian Quan

Date Created:

Not specified

Course Title:

Professor:

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About Paper:

As semiconductor systems become more power-dense, traditional cooling methods become suboptimal, causing undesirable effects such as extreme temperature gradients and pressure drops across the cooler. For such kind of high heat flux applications, direct multi jet impingement is an attractive solution. The impinging jets offer a thinner boundary layer resulting in increases in the convective heat transfer coefficient and improves cooling performance. This presentation proposes a novel cooler manifold design with distributed inlet and outlet channels for the delivery and removal of the coolant. The new manifold design consists of a 5 x 5 and 6 x 6 array of inlet nozzles and is manufactured using advanced additive manufacturing technology and tested for thermal fluid performance experimentally. To understand the fluid flow and thermal performance of the manifold design, a numerical investigation is performed using ANSYS fluent and verified with experimental results. The expected results aim to provide a better understanding of the design of jet impingement coolers and aims to provide guidelines for future cooler designs. Future studies can incorporate denser converging nozzle grid arrays using the numerical solution model with technologies such as topology optimization to improve flow uniformity across all the nozzle outlets, improving jet uniformity across the entire cooler surface, and decreasing the temperature gradient across the cooler surface. Future cooler iterations can also be extrapolated to larger nozzle grid arrays. Keywords: Heat Transfer; Semiconductor Cooling; Additive Manufacturing; Numerical Analysis; Jet Impingement

Source:

Purdue University / 2024

Topics:

No topics listed

Co-authors:

Ian Quan