Authors:

Justin E Bullock

Date Created:

Not specified

Course Title:

Professor:

Not specified

About Paper:

Counterfeit computer chips pose significant risks to the security and reliability of consumer electronics, with potential implications for user safety. This research project explores improved methods for verifying chip authenticity through a comprehensive literature review. The study begins with the identification of a seed paper, from which key terms were extracted and used to conduct a refined search in Scopus using Boolean AND operations. The resulting datasets were exported as CSV files for screening and evaluation. Relevant articles, identified through a systematic review process, were categorized based on the testing methods they described. These methods fall into three main categories: External Inspection, Internal Inspection, and Electrical Testing. External Inspection techniques including both optical and physical techniques, such as visual inspection, weight measurement, dimensional analysis, and X-ray fluorescence (XRF), can detect different anomalies, but one given technique may not always suffice. Internal features such as internal chip locations and layout, and wire bonds or interconnects are more difficult to measure quickly and require a reliable basis for comparison. Electrical testing can help detect questionable components when it can benefit from reliable guidelines from the manufacturers, such as technical datasheets listing the electrical characteristics in detail. These findings of complementary strengths and weaknesses suggest that a combination of External Inspection, Internal Inspection, and Electrical Testing may offer a more robust strategy for detecting counterfeit chips. Further research is recommended to validate integrated approaches and improve detection accuracy. Keywords: [no keywords provided]

Source:

Purdue University / 2025

Topics:

No topics listed

Co-authors:

Justin E Bullock