Authors:

Ben N Aaron

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About Paper:

Peridynamics, a framework for non-local continuum mechanics, and the cohesive zone model (CZM), which characterizes fracture along a cohesive layer, have acted as important tools for modeling fracture mechanics of crack propagation. However, film peeling, a mechanics problem with appropriate constraints for a peridynamics and cohesive zone model, has been understudied despite relevance to a range of physical applications, including the everyday adhesive tapes or the laminates of structural materials. We aim to identify the conditions and failure modes under which a tear occurs when a thin film adhered to a rigid substrate undergoes bending while being peeled. This work also identifies parameters for which the film is peeled off cleanly without leaving residue. Using the PDMATLAB2D coding framework for peridynamics in 2D planes, we simulate peeling under plane strain and quasi-static loading conditions, allowing for the model to reach a steady state as loading is incremented to minimize inertial effects. Relevant tested variable parameters include the thickness of the adhesive film, the angle of loading, and the rigidity of the film. This study compares our results across levels of fineness in our simulations and in reference to the limited existing models to validate and verify our findings. This research addresses the film peeling problem with recommendations for parameters of interest in future modeling. Further testing of the findings could be achieved with experimentation with adhesives of known material properties, especially the adhesives used in tapes, stickers, and other products for which a clean peel is desired. Keywords: Peridynamics; Fracture Mechanics; Cohesive Zone Model

Source:

Purdue University / 2025

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Co-authors:

Ben N Aaron