Authors:

Xavier L Ish

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About Paper:

Thermal interface materials (TIMs) are commonly used in electronic systems to facilitate the dissipation of heat from heat sources like electrical components to outside heat sinks. TIMs consist of thermally conductive particles in a polymeric matrix that ensures high thermal conductivity along with the ability to adhere to the surface. However, typical thermal cycles associated with electronic systems can lead to the loss of thermal performance of TIMs over time. Several literature studies have reported the degradation in electronic packages in the ambient environment. As packages become power dense with time, improved thermal management is critical for healthy functioning of chips and immersion cooling is one of the possible strategies. This technique involves submerging the packages in dielectric fluids with relatively higher thermal conductivity than air. While the technology gains traction, there are major concerns with the reliability of the package, including the integrity of TIMs. This research aims to study the degradation of TIMs in submerged conditions and extend the current reliability studies to better predict the performance deterioration. The testing setup consists of a TIM sandwiched between two aluminum bars, which are connected to a heater and cooler to establish a temperature gradient across the TIM. The TIM and a portion of the aluminum bars are immersed in a dielectric liquid. Each aluminum bar has thermocouples inserted along its length so the temperature gradient can be measured. These temperature readings will allow for characterization of the thermal resistance of the TIM and allow in situ monitoring for degradation. This research will allow us to better understand the behavior of TIMs used in liquid immersion cooling and provide insight into their reliability in submerged conditions. Keywords: AI Chips; Thermal Interface Materials; Immersion Cooling; Thermal Management; Reliability

Source:

Purdue University / 2025

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Co-authors:

Xavier L Ish