Authors:

Timothy P Malloy

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About Paper:

Solder joints play a crucial role in the structural and electrical interconnection between the semiconductor components within electronic assemblies. However, due to their micro-scale, structural complexity, and complex viscoplastic mechanical behavior, it is a challenge to maintain these expectations. For proper inspection and analysis, the reflow process-a thermal soldering technique used to make solder joint samples-and mechanical tests are implemented. The success of the reflow process depends heavily on proper flux control, solder ball alignment, and reflow temperature management, with common defects arising from poor glue application or uneven reflow conditions. By implementing a closed-loop capacitively controlled sub-micron precision mechanical tester, nine monotonic tests and nine creep tests were conducted for 42SnBi-1Sb-1Ag solder alloy at three different temperatures, 30°C, 37.5°C, and 45°C. Monotonic tests were performed at three different strain rates, from 7.7 * 10^-5s^-1 to 7.7 * 10^-3s^-1, while creep tests were run at three stress levels, 5.17MPa, 10.35 MPa, and 15.52 MPa. The results from nine monotonic and nine creep tests are used to fit well-established viscoplastic constitutive models, including the Anand model and the Time hardening creep model, to predict monotonic and creep behaviors. The material parameters extracted from these constitutive models describe properties such as strain rate sensitivity, activation energy, and they can be used in future FEA simulations. Keywords: [no keywords provided]

Source:

Purdue University / 2025

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Co-authors:

Timothy P Malloy