Authors:

Duc Minh Hoang

Date Created:

Not specified

Course Title:

Professor:

Not specified

About Paper:

The continuing miniaturization and high-density packaging lead to a significant rise in heat load of the high-performance GPU, reaching ~1000 W for NVIDIA B200. Liquid cooling with an efficient thermal management solution is required to maintain a lower operating temperature of such device. In this study, direct-on-chip cooling with multi-jets with distributed inlet and outlet is proposed for a 2.5D interposer package. Overall manifold height is kept at 5 mm with a lateral feeding of coolant to make it more appealing for data center cooling application. Also, special provision in manifold design is provided to ensure leak-tight solutions and to integrate with the stiffener of the NVIDIA V100 chip, making it a lid-compatible manifold solution. After the integration of the 3D printed manifold, thermo-hydraulic performance is tested for various coolant flow rates and GPU load. The thermal design power, TDP of this chip is 300 W. The working fluid R1233zd(E) is dielectric, and the tests are performed at a saturation temperature of 37.5°C. GPU temperature is measured using an embedded sensor within the chip. Heat transfer coefficient, vapor quality, and pressure drop across the manifold is additionally measured to have a detailed performance map of the system. Also, thermal performance is studied for a dynamic power load, by step varying from idle power (~42 W) to TDP, mimicking real-time conditions. Overall, the current manifold provides an excellent thermal management solution with a robust packaging solution for high-power AI chips. Keywords: Electronic Cooling; Jet Impingement; GPU; Thermal Management

Source:

Purdue University / 2025

Topics:

No topics listed

Co-authors:

Duc Minh Hoang