Authors:

Mike Xiao

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About Paper:

The peeling of thin films is a crucial process in various applications ranging from engineering to biomedical systems, such as the design of highly resistant structures and drug delivery patches. However, there is currently a limited understanding of uncontrolled fracture during peeling despite its widespread use, leading to material waste and inefficiencies. We aim to investigate parameters in which a thin film attached to a rigid substrate can be cleanly peeled off without leaving any residue. In contrast, outside of this regime the peeling process results in fracture of the film. An open-source MATLAB code named PDMATLAB2D(PD) is used to model peeling under various critical conditions like film thickness, material property, and fracture energy. The PD simulations generate stress-strain data, crack propagation patterns, and energy dissipation metrics, which are analyzed to identify fracture thresholds. Our simulations reveal that there is a specific range of conditions where residual-free peeling occurs. The findings will provide guidelines for optimizing peeling processes to enhance manufacturing reliability and material performance. Further studies can be achieved by examining fracture modes of different materials. Keywords: Peridynamics; Fracture Mechanics; PDMATLAB2D; Thin-Film Peeling; Clean Peeling

Source:

Purdue University / 2025

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No topics listed

Co-authors:

Mike Xiao