Authors:

Ian Strachan

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About Paper:

Solder materials such as SAC305 are commonly used in electronics, and understanding their mechanical properties is critical for making sure these electronics are reliable. Previous experiments have shown that adding Bismuth (Bi) to SAC305 increases the hardness, while increasing strain-softening behavior. Researchers were able to see this effect using two different types of nanoindenters: Berkovich and Cube-corner, which have different tip angles and result in different plastic strain, 8% and 22% respectively. To explore this behavior further, finite element analysis (FEA) is being used to model how SAC305 and SAC305 with 1-3% Bi behave when indented. With 2D axisymmetric models of the indenters that create different angles and apply material properties based on experimental data. Simulations such as these are valuable because they provide detailed insight into subsurface stress and strain distributions, which are often difficult or even impossible to capture accurately through traditional experimental techniques. The results are expected to show that sharper indenters, like the Cube-corner, cause more concentrated plastic deformation than the Berkovich tip. Similar to the experimental observations, it is predicted that the Bi-added allows will respond with higher overall flow stress. These simulations will provide an explanation as to why the materials behave the way they do and support future work on designing better solder materials for high-temperature electronics. Keywords: Nanoindentation; SAC305; Strain-Softening; Abaqus; Simulation

Source:

Purdue University / 2025

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Co-authors:

Ian Strachan